Welina mai i kā mākou mau pūnaewele!
PCBA no ka hana sensor
| Awa FOB | Kina (ʻāina nui) |
| Ka manawa o waena o ka hoʻomaka a i ka wā pau | 7-15 mau lā |
- Hui SMT
- 2 hoʻonohonoho i ka mīkini SMT kiʻekiʻe
- Hoʻonohonoho ʻo 2 i nā mea paʻi ʻakomi me ka alignment fiduciary
- 2 hoʻonohonoho i nā mīkini hoʻokolohua ICT
- Hui THT
- 2 pūʻulu laina mīkini hoʻoheheʻe nalu
- 1 pūʻulu o ka mea hoʻokomo mea ʻakomi: IST-4000
- ISO 9001:2008
- UL palapala hōʻoia
- IPC-610D/E, hoʻokō papa II
- ICT, AOI, hoao hana
- Ka mālama waiwai ma lalo o ka ʻōnaehana ERP
- 1) Hui SMT me ka hui BGA
- 2) ʻAe ʻia nā ʻāpana SMD: 01005, BGA, QFP, QFN, TSOP
- 3) Ke kiʻekiʻe o ka mea: 0.2-25mm
- 4) Hoʻopili liʻiliʻi: 0201
- 5) Min mamao ma waena o BGA: 0.25-2.0mm
- 6) Min BGA nui: 0.1-0.63mm
- 7) Min QFP wahi: 0.35mm
- 8) Ka nui hui min: (X) 50 * (Y) 30mm
- 9) Nui hui nui: (X): 350 * (Y) 550mm
- 10) Koho-kau pono: ± 0.01mm
- 11) Hiki ke hoʻokomo: 0805, 0603, 0402, 0201
- 12) Loaʻa ke kūpono paʻi helu kiʻekiʻe
- 13) Ka mana SMT i kēlā me kēia lā: 800,000 mau helu
- 1) ʻO ke kuleana huahana koʻikoʻi, e lawe ana i ka maʻamau IPC-A-160
- 2) Hana mua ʻenehana ma mua o ka hana ʻana
- 3) Mana kaʻina hana hana (5ms)
- 4) 100% E-hōʻoia, 100% nānā ʻike, me IQC, IPQC, FQC, OQC
- 5) 100% AOI inspection, me ka X-ray, 3D microscope a me ICT
- 6) Ho'āʻo kiʻekiʻe-voltage, ho'āʻo mana impedance
- 7)Microsection, kaha kūʻai, ho'āʻo koʻikoʻi wela, ho'āʻo haʻalulu
- 8) Hana PCB i loko o ka hale
- 9) ʻAʻohe helu kauoha liʻiliʻi a me ka laʻana manuahi
- 10) E noʻonoʻo i ka hana haʻahaʻa haʻahaʻa
- 11) Hoʻouna wikiwiki a me ka manawa
- - ʻAsia
- - Australasia
- - ʻAmelika Waena/ Hema
- - ʻEulopa Hikina
- - Hikina Hikina/ʻApelika
- - ʻAmelika ʻĀkau
- - ʻEulopa Komohana
E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou
