ʻO OEM PCBA Clone Assembly Service 'ē aʻe PCB & PCBA Custom Electronics PCB Circuit Board

Hōʻike

ʻO ka mana ʻenehana PCB

Nā Papa Hana nui: 2~58 papa / Pilot holo: 64 papa

Max.Mānoanoa Nui hana: 394mil (10mm) / Pilot holo: 17.5mm

Mea Hana FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead free assembly material), Halogen-Free, Ceramic piha, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partal hybrid, etc

Min.Laulā/Spacing Papa loko: 3mil/3mil (HOZ), Papa waho: 4mil/4mil(1OZ)

Max.Mānoanoa keleawe 6.0 OZ / Pilot holo: 12OZ

Min.Ka nui o ka lua mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)

Hoʻopau i ka ʻili HASL, Gula Kaiapuni, Kino Kaiapuni, OSP, ENIG + OSP, Kaiapuni , ENEPIG, Manalima Gula

Ke Kaʻina Hana Kūikawā i kanu ʻia ka lua, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partal hybrid, Partal high density, Back drilling, and Resistance control

ʻO ka mana ʻenehana PCBA

Nā Pōmaikaʻi ---- ʻO ka ʻenehana kūʻai ʻana i ka Surface a me ka ʻenehana kūʻai ʻana ma o ka puka

----ʻO nā nui like ʻole e like me 1206,0805,0603 mau mea ʻenehana SMT

----ICT(Ma ka Ho'āʻo Kaapuni),FCT(Hoʻāʻo Kaapuni Hana)

---- Huihui PCB Me ka UL, CE, FCC, Rohs Apono

---- Nitrogen kinoea reflow soldering enehana no SMT.

---- Kiʻekiʻe SMT & Solder Hui Laina

----High density interconnected board placement technology capacity.

Nā ʻāpana Passive i lalo i ka nui 0201, BGA a me VFBGA, Leadless Chip Carriers/CSP

ʻAhaʻi ʻelua ʻaoʻao SMT, Pitch maikaʻi i 0.8mils, Hoʻoponopono BGA a me Reball

Ke ho'āʻo ʻana i ka hoʻāʻo ʻana i ka lele, X-ray Inspection AOI Test