ʻO OEM PCBA Clone Assembly Service 'ē aʻe PCB & PCBA Custom Electronics PCB Circuit Board

ʻO ka wehewehe pōkole:

Hoʻohana: Aerospace, BMS, kamaʻilio, kamepiula, mea kūʻai uila, mea hana hale, LED, nā mea lapaʻau, papa makuahine, uila uila, hoʻopiʻi uila.

Hiʻona: PCB maʻalahi, PCB kiʻekiʻe kiʻekiʻe

Nā mea hoʻoheheʻe: Epoxy Resin, Metal Composite Materials, Organic Resin

Mea: Aluminum Uhi Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Pepa Phenolic Copper Foil Substrate, Synthetic Fiber

ʻenehana hoʻoponopono: Hoʻopaneʻe i ka Foil Pressure, Foil Electrolytic

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Hōʻike

ʻO ka mana ʻenehana PCB

Nā Papa Hana nui: 2~58 papa / Pilot holo: 64 papa

Max. Mānoanoa Nui hana: 394mil (10mm) / Pilot holo: 17.5mm

Mea FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Lead free assembly material), Halogen-Free, Ceramic piha, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partal hybrid, etc.

Min. Laulā/Spacing Papa loko: 3mil/3mil (HOZ), Papa waho: 4mil/4mil(1OZ)

Max. Mānoanoa keleawe 6.0 OZ / Pilot holo: 12OZ

Min. Ka nui o ka lua mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm)

Hoʻopau i ka ʻili HASL, Gula Kaiapuni, Kino Kaiapuni, OSP, ENIG + OSP, Kaiapuni , ENEPIG, Manalima Gula

Ke Kaʻina Kūikawā i kanu ʻia ka lua, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partal hybrid, Partal high density, Back drilling, and Resistance control

ʻO ka mana ʻenehana PCBA

Nā Pōmaikaʻi ---- ʻO ka ʻenehana kūʻai ʻana i ka Surface a me ka ʻenehana kūʻai ʻana ma o ka puka

----ʻO nā nui like ʻole e like me 1206,0805,0603 mau mea ʻenehana SMT

----ICT(Ma ka Ho'āʻo Kaapuni),FCT(Hoʻāʻo Kaapuni Hana)

---- Huihui PCB Me UL, CE, FCC, Rohs Apono

---- Nitrogen kinoea reflow soldering enehana no SMT.

---- Kiʻekiʻe SMT & Solder Hui Laina

----High density interconnected board placement technology capacity.

Nā ʻāpana Passive i lalo i ka nui 0201, BGA a me VFBGA, Leadless Chip Carriers/CSP

ʻAhaʻi ʻelua ʻaoʻao SMT, Pitch maikaʻi i 0.8mils, Hoʻoponopono BGA a me Reball

Ke ho'āʻo ʻana i ka hoʻāʻo ʻana i ka lele, X-ray Inspection AOI Test

SMT Kūlana pololei	20 um
Ka nui o nā mea	0.4×0.2mm(01005) —130×79mm, Flip-CHIP, QFP, BGA, POP
Max. kiʻekiʻe ʻāpana	25mm
Max. Nui PCB	680×500mm
Min. Nui PCB	ʻaʻohe palena
PCB mānoanoa	0.3 a 6mm
Wave-Solder Max. PCB laula	450mm
Min. PCB laula	ʻaʻohe palena
Kiʻekiʻe o ka mea	Kiʻekiʻe 120mm/Bot 15mm
ʻAno Metala Sweat-Solder	ʻāpana, holoʻokoʻa, inlay, sidestep
Mea metala	Copper, Aluminum
Hoʻopau ʻili	hoʻopalapala Au, , hoʻopalapala Sn
Ka nui o ka ʻōpū o ka ea	emi ma lalo o 20%
Paʻi-fit Laulā kaomi	0-50KN
Max. Nui PCB	800X600mm