Ma ka laulā, ʻelua mau lula nui no ka hoʻolālā laminated:
1. Pono e loa'a i kēlā me kēia papa alahele kahi papa kuhikuhi pili (ka lako mana a i 'ole ka ho'okumu 'ana);
2. ʻO ka papa mana nui e pili ana a me ka lepo e mālama ʻia i kahi mamao liʻiliʻi e hāʻawi i kahi capacitance hui nui;
Eia kekahi laʻana o ka waihona ʻelua-papa a ʻewalu-papa:
A.single-ʻaoʻao PCB papa a papalua-ʻaoʻao PCB papa laminated
No nā papa ʻelua, no ka mea liʻiliʻi ka helu o nā papa, ʻaʻohe pilikia lamination.Manaʻo nui ʻia ka mana radiation EMI mai ka wili a me ka hoʻolālā;
ʻO ka hoʻohālikelike electromagnetic o nā papa hoʻokahi a me nā papa pālua e lilo i mea kaulana loa.ʻO ke kumu nui o kēia ʻano, ʻo ia ka nui o ka ʻāpana o ka loop signal, ʻaʻole ia e hoʻopuka wale i ka pāhawewe electromagnetic ikaika, akā hoʻolilo pū i ke kaapuni i ka hoʻopili ʻana i waho.ʻO ke ala maʻalahi e hoʻomaikaʻi ai i ka hoʻohālikelike electromagnetic o kahi laina ʻo ia ka hoʻemi ʻana i ka ʻāpana loop o kahi hōʻailona koʻikoʻi.
Hōʻailona koʻikoʻi: Mai ka hiʻohiʻona o ka hoʻohālikelike electromagnetic, ʻo ka hōʻailona koʻikoʻi e pili ana i ka hōʻailona e hoʻopuka ana i ka radiation ikaika a pili i ka honua o waho.ʻO nā hōʻailona hiki ke hoʻopuka i ka radiation ikaika he mau hōʻailona manawa, e like me nā hōʻailona haʻahaʻa o nā uaki a i ʻole nā helu wahi.ʻO nā hōʻailona koʻikoʻi o ka hoʻopili ʻana ʻo ia nā mea me nā pae haʻahaʻa o nā hōʻailona analog.
Hoʻohana pinepine ʻia nā papa papa hoʻokahi a me ka papalua i nā hoʻolālā simulation haʻahaʻa haʻahaʻa ma lalo o 10KHz:
1) E hoʻokele i nā kaula mana ma ka papa hoʻokahi ma ke ʻano radial, a e hōʻemi i ka huina o ka lōʻihi o nā laina;
2) I ka hele ʻana i ka lako mana a me ka uea honua, kokoke i kekahi i kekahi;E hoʻomoe i ka uea honua ma kahi kokoke i ka uea hōʻailona kī.No laila, ua hoʻokumu ʻia kahi ʻāpana loop liʻiliʻi a ua hoʻemi ʻia ka naʻau o ka radiation mode differential i ke keakea o waho.Ke hoʻohui ʻia kahi uea honua ma ka ʻaoʻao o ka uea hōʻailona, ua hoʻokumu ʻia kahi kaapuni me ka ʻāpana liʻiliʻi loa, a pono e hoʻokele ʻia ke au o ka hōʻailona ma kēia kaapuni ma mua o ke ala ʻē aʻe.
3) Ina he papa kaapuni papalua, hiki ia ma kela aoao o ka papa kaapuni, kokoke i ka laina hoailona ma lalo, ma ka laina laina lole he uwea honua, he laina e like me ka laula.ʻO ka ʻāpana kaapuni i loaʻa e like me ka mānoanoa o ka papa kaapuni i hoʻonui ʻia me ka lōʻihi o ka laina hōʻailona.
B.Lamination o eha papa
1. Sig-gnd (PWR)-PWR (GND)-SIG;
2. GND-SIG(PWR)-SIG(PWR)-GND;
No kēia mau hoʻolālā laminated ʻelua, aia ka pilikia me ka mānoanoa pā maʻamau 1.6mm (62mil).E lilo ka laula i mea nui, ʻaʻole kūpono wale i ka hoʻomalu ʻana i ka impedance, ka hoʻopili ʻana o ka interlayer a me ka pale;ʻO ka mea nui, ʻo ka spacing nui ma waena o ka strata lako mana e hōʻemi i ka capacitance plate a ʻaʻole kūpono i ka kānana kani.
No ka papahana mua, hoʻohana maʻamau ia i ka nui o nā chips ma ka papa.Hiki i kēia hoʻolālā ke loaʻa i ka hana SI maikaʻi aʻe, akā ʻaʻole maikaʻi loa ka hana EMI, ʻo ia ka mea i hoʻomalu ʻia e ka wili a me nā kikoʻī ʻē aʻe.Manaʻo nui: Hoʻokomo ʻia ka hoʻokumu ʻana i ka papa hōʻailona o ka papa hōʻailona ʻoi loa, kūpono i ka absorption a me ka hoʻopau ʻana i ka radiation;E hoʻonui i ka ʻāpana pā e hōʻike i ka lula 20H.
No ka papahana ʻelua, hoʻohana maʻamau ia i kahi haʻahaʻa haʻahaʻa o ka puʻupuʻu chip ma ka papa a ua lawa ka wahi a puni ka chip e kau ai i ka uhi keleawe mana.Ma kēia papahana, ʻo ka papa waho o ka PCB he stratum a pau, a ʻo nā papa waena ʻelua he hōʻailona / mana mana.Hoʻopili ʻia ka mana mana ma ka papa hōʻailona me kahi laina ākea, hiki ke hoʻohaʻahaʻa i ke ala impedance o ka mana lako i kēia manawa, a haʻahaʻa hoʻi ka impedance o ke ala microstrip hōʻailona, a hiki nō hoʻi ke pale i ka radiation hōʻailona o loko ma o waho. papa.Mai kahi mana o EMI, ʻo kēia ka ʻōnaehana PCB 4-layer maikaʻi loa i loaʻa.
Manaʻo nui: ʻo ka waena waena ʻelua o ka hōʻailona, pono e wehe ʻia ka spacing mana hui pū ʻana, ʻo ke kuhikuhi o ka laina ke kū pololei, pale i ka crosstalk;ʻĀpana papa mana kūpono, e hōʻike ana i nā lula 20H;Ina e hoomaluia ka impedance o na uwea, e waiho akahele loa i na uwea malalo o na mokupuni keleawe o ka mana a me ka lepo.Eia kekahi, pono e hoʻopili ʻia ka lako mana a i ʻole ka waiho ʻana i ke keleawe e like me ka hiki ke hōʻoia i ka DC a me ka haʻahaʻa haʻahaʻa.
C.Lamination o eono papa o na papa
No ka hoʻolālā ʻana o ka puʻupuʻu chip kiʻekiʻe a me ke alapine uaki kiʻekiʻe, pono e noʻonoʻo ʻia ka hoʻolālā ʻana o ka papa 6-layer.Paipai ʻia ke ʻano lamination:
1.SIG-GND-SIG-PWR-GND-SIG;
No kēia hoʻolālā, loaʻa i ka lamination scheme ke kūpaʻa hōʻailona maikaʻi, me ka ʻāpana hōʻailona e pili ana i ka papa honua, ka mana o ka mana i hui pū ʻia me ka papa honua, hiki ke hoʻomalu maikaʻi ʻia ka impedance o kēlā me kēia papa alahele, a hiki i nā papa ʻelua ke hoʻopaʻa maikaʻi i nā laina magnetic. .Eia hou, hiki iā ia ke hāʻawi i ke ala hoʻihoʻi maikaʻi no kēlā me kēia papa hōʻailona ma lalo o ke kūlana o ka lako mana piha a me ka hoʻokumu ʻana.
2. GND-SIG-GND-PWR-SIG-GND;
No kēia papahana, pili kēia papahana i ka hihia inā ʻaʻole kiʻekiʻe ka nui o ka hāmeʻa.Loaʻa i kēia papa nā mea maikaʻi a pau o ka papa luna, a ʻo ka papa honua o ka papa luna a me lalo he mea paʻa, hiki ke hoʻohana ʻia ma ke ʻano he pale pale maikaʻi.He mea nui e hoʻomaopopo i ka mana o ka mana e kokoke i ka papa ʻaʻole i ka mokulele ʻāpana nui, no ka mea e ʻoi aku ka piha o ka mokulele lalo.No laila, ʻoi aku ka maikaʻi o ka hana EMI ma mua o ka papahana mua.
Hōʻuluʻulu manaʻo: No ka papahana o nā papa ʻeono, pono e hoʻemi ʻia ka mamao ma waena o ka papa mana a me ka lepo no ka loaʻa ʻana o ka mana maikaʻi a me ka hoʻohui ʻāina.Eia nō naʻe, ʻoiai ua hoʻemi ʻia ka mānoanoa pā o 62mil a me ke kaʻawale ma waena o nā papa, he paʻakikī nō ka hoʻomalu ʻana i ka mamao ma waena o ke kumu mana nui a me ka papa honua liʻiliʻi loa.Ke hoʻohālikelikeʻia me ka papahana mua a me ka papahanaʻelua, ua hoʻonui nuiʻia ke kumukūʻai o ka papahanaʻelua.No laila, koho mākou i ka koho mua i ka wā e hoʻopaʻa ai mākou.I ka wā hoʻolālā, e hahai i nā lula 20H a me nā lula papa aniani.
D.Lamination o ewalu papa
1, Ma muli o ka hemahema electromagnetic absorption hiki a me ka mana nui impedance, ʻaʻole kēia he ala maikaʻi o ka lamination.Penei kona hale.
1.Signal 1 māhele ili, microstrip uwea papa
2.Signal 2 i loko o ka microstrip routing layer, maikaʻi routing layer (X kuhikuhi)
3. Ka honua
4.Signal 3 Strip line routing layer, maikaʻi routing layer (Y direction)
5.Signal 4 Cable routing layer
6.Ka mana
7.Signal 5 i loko o ka microstrip uwila papa
8.Signal 6 Microstrip uwea papa
2. He ʻano ʻokoʻa ia o ke ʻano hoʻopaʻa ʻekolu.Ma muli o ka hoʻohui ʻana o ka papa kuhikuhi, ʻoi aku ka maikaʻi o ka hana EMI, a hiki ke hoʻomalu maikaʻi ʻia ke ʻano impedance o kēlā me kēia papa hōʻailona.
1.Signal 1 māhele 'ilikai, microstrip uea papa, maikai uwea papa
2. Ground stratum, maikaʻi electromagnetic hawewe absorption hiki
3.Signal 2 Cable routing layer.ʻO ka papa hoʻokele uwea maikaʻi
4.Power papa, a me keia strata constitute maikaʻi electromagnetic absorption 5. Ground stratum
6.Signal 3 Cable routing layer.ʻO ka papa hoʻokele uwea maikaʻi
7.Power hoʻokumu, me ka mana nui impedance
8.Signal 4 Microstrip cable layer.ʻO ke kaula kaula maikaʻi
3, ʻO ke ʻano stacking maikaʻi loa, no ka mea, ʻoi aku ka maikaʻi o ka hoʻohana ʻana i ka mokulele ʻo multi-layer ground reference.
1.Signal 1 māhele 'ilikai, microstrip uea papa, maikai uwea papa
2. Ground stratum, maikaʻi electromagnetic hawewe absorption hiki
3.Signal 2 Cable routing layer.ʻO ka papa hoʻokele uwea maikaʻi
4.Power papa, a me keia strata constitute maikaʻi electromagnetic absorption 5. Ground stratum
6.Signal 3 Cable routing layer.ʻO ka papa hoʻokele uwea maikaʻi
7. Ground stratum, ʻoi aku ka maikaʻi o ka hawewe electromagnetic
8.Signal 4 Microstrip cable layer.ʻO ke kaula kaula maikaʻi
ʻO ke koho ʻana i ka nui o nā papa e hoʻohana ai a pehea e hoʻohana ai i nā papa e pili ana i ka helu o nā pūnaewele hōʻailona ma ka papa, ka nui o ka hāmeʻa, ka nui o ka PIN, ka pinepine o ka hōʻailona, ka nui o ka papa a me nā mea ʻē aʻe he nui.Pono mākou e noʻonoʻo i kēia mau mea.ʻOi aku ka nui o nā pūnaewele hōʻailona, ʻoi aku ka kiʻekiʻe o ka mīkini, ʻoi aku ka kiʻekiʻe o ka nui o ka PIN, ʻoi aku ka kiʻekiʻe o ke alapine o ka hoʻolālā hōʻailona e hoʻokō ʻia i ka hiki.No ka hana EMI maikaʻi ʻoi aku ka maikaʻi e hōʻoia i kēlā me kēia papa hōʻailona i kona papa kuhikuhi ponoʻī.
Ka manawa hoʻouna: Iune-26-2023