Hiʻona: Kākoʻo maʻamau
Nā Papahana: Papalua-Layer, Multilayer, Single-Layer
ʻAi Metala: Kālā, Kina
Ke ano o ka hana ana:SMT
ʻAno: BMS PCBA, PCBA kamaʻilio, PCBA mea kūʻai uila, PCBA mea hana hale, PCBA LED, PCBA papa makuahine, PCBA uila akamai, PCBA hoʻopaʻa uila.
Hoʻohana: Mea uila, uila OEM
ʻAno mea kūʻai: hale hana, mea hana, OEM/odm
Hoʻopau i ka ʻili: Hasl, Hasl alakaʻi manuahi
Ka helu kumu hoʻohālike:SHE75192A-101H(A1)
Kahi o ke kumu: Guangdong, Kina
Kapa inoa:Sanhua
Mānoanoa keleawe:5 oz
Nā kikoʻī kikoʻī/ nā hiʻohiʻona kūikawā:
Kiʻekiʻe kiʻekiʻe interconnected 'ike loea hoonoho papa
Nā kikoʻī kikoʻī/ nā hiʻohiʻona kūikawā:
ʻO mākou ka mea hana nui PCB ma ka moku ʻo Shenzhen Kina, me ka UL a me TS 16949 i ʻae ʻia, kokoke ko mākou wahi i Shanghai me ka lawe kūpono.
ʻO kā mākou huahana i hoʻohana nui ʻia i nā kukui LED i loko a me waho, nā kukui kaʻa a me nā māla kukui a me nā mea hou aku,
Hana ʻia nā MC PCB āpau, e ʻoluʻolu e hoʻouna i ka faila Gerber a me nā koi no kahi ʻōlelo.
Nā kikoʻī kikoʻī/ nā hiʻohiʻona kūikawā:
He loea ʻo XinDaChang i nā wahi aʻe:
ʻO ka PCBA clone a me ka PCB hui PCB hoʻolālā a me ka hana.
Lead- Free HASL / Plating gula / immersion gula / Ni / Au Plating manamana gula.
Kūʻai ʻāpana.
Mea hoʻolako hoʻoponopono hoʻohui.
ʻaoʻao hoʻokahi, ʻaoʻao ʻelua, multilayer.
Hoʻololi, pili i nā koi o ka mea kūʻai aku.
ʻOmaomao/ ʻEleʻele/ ʻulaʻula/ Melemele/ Keʻokeʻo/ʻulaʻula…
Hāʻawi i nā huahana me ke kumukūʻai hoʻokūkū.
ʻO ka manawa alakaʻi pōkole.
Noi:
Aerospace, BMS, Hoʻokaʻaʻike, Kamepiula, Mea Hoʻohana Mea Hoʻohana, Mea Hana Home, LED, Mea Hana Lapaʻau, Papa makuahine, ʻelepona akamai, Hoʻopiʻi uila.
Hiʻona:PCB Fexible, PCB mānoanoa kiʻekiʻe.
Nā mea hoʻolalelale:Epoxy Resin, Metala Composite Material, Organic Resin.
Material:ʻO ka Aluminum Uhi Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Pepa Phenolic Copper Foil Substrate, Synthetic Fiber.
ʻenehana hana: Hoʻopaneʻe Paʻi Foil, Electrolytic Foil.
Nā kikoʻī kikoʻī/ nā hiʻohiʻona kūikawā:
ʻO kā mākou lawelawe
• One-stop turnkey OEM / ODM PCBA lawelawe.
• pcb, hoʻolālā pcb, PCBA, hui PCB: SMT, PTH a me BGA, Hana Hana ʻaelike, lawelawe Turnkey, Nā lawelawe ʻenehana.
• Hoʻopili a kūʻai ʻana i nā mea uila.
• Ke ahi polokalamu.
• Ho'āʻo: AOI, X-Ray, ho'āʻo kaapuni (ICT), ho'āʻo hana (FCT).
• Hoʻopili wikiwiki, NPI, DFM/DFT, hana hoʻopaʻa, hoʻolālā paʻi.
• Uea kaula, hui uwea, hui metala pepa ,Plastics a me Molds.
• Hui hua hope loa.
Nā kikoʻī nui/Nā hiʻohiʻona:
ʻO kā mākou pono
• waiwai waiwai i ka uila manufacturing lawelawe no PCB PCBA.
• lawelawe hoʻokahi | | Ke kūʻai aku nei nā ʻāpana hana PCB a me ka hui PCB, kōkua maʻalahi iā ʻoe e hoʻokō i kāu huahana uila.
• Ke hui pū nei mākou ma nā ʻoihana e pili ana i ke kelepona, Internet of Things, radio frequency, intelligent control, security, medical, industry.kaʻa, nā huahana 3G/4G/5G.
• Kumukūʻai kūpono a paʻa: Ua hoʻokumu ʻia kahi kaulahao hoʻolako honua ikaika o nā mea uila e kōkua iā mākou e loaʻa nā kumukūʻai kūpono a paʻa.
Nā kikoʻī kikoʻī/ nā hiʻohiʻona kūikawā:
Hoʻohui ʻia ʻo PCB i nā kikoʻī kikoʻī / hiʻohiʻona kūikawā:
ʻO kā mākou hui PCB / OEM / ODM ʻaelike hana lawelawe ma mua o 10 mau makahiki:
Ka hana a me ka hoʻolālā PCB: 1 a 20 mau papa
Nā mea hiki ke kūʻai honua
ʻO ka mana mīkini
Hui PCB (SMT + DIP + papahana + hoʻāʻo)
Nā kikoʻī kikoʻī/ nā hiʻohiʻona kūikawā:
He aha ka XinDaChang e hāʻawi ai:
1. Ahahui Papa Kaapuni Pai
2. Turnkey & Box Build hui
3. hui 'enehana PCB hui
4. Hui uwea a me uea
5. Haʻahaʻa / Mid / High volum PCB hui
6. Hui BGA / QFN me ka nānā X-ray
7. Hoʻolālā IC / hoʻāʻo hana / nānā ICT
8. ʻO ka pane wikiwiki e pili ana i ka ʻōlelo a me ke kūkākūkā ʻenehana a me ka hāʻawi ʻana
Noi:
Aerospace, BMS, Hoʻokaʻaʻike, Kamepiula, Mea Hoʻohana Mea Hoʻohana, Mea Hana Home, LED, Mea Hana Lapaʻau, Papa makuahine, ʻelepona akamai, Hoʻopiʻi uila.
Hiʻona:PCB Fexible, PCB mānoanoa kiʻekiʻe.
Nā mea hoʻolalelale:Epoxy Resin, Metala Composite Material, Organic Resin.
Material:ʻO ka Aluminum Uhi Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Pepa Phenolic Copper Foil Substrate, Synthetic Fiber.
ʻenehana hana: Hoʻopaneʻe Paʻi Foil, Electrolytic Foil