Nā huahana
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Oem Pcba Papa Ahaolelo Kaulike Pcba Assembly Services
Hoʻohana: Aerospace, BMS, kamaʻilio, kamepiula, mea kūʻai uila, mea hana hale, LED, nā mea lapaʻau, papa makuahine, uila uila, hoʻopiʻi uila.
Hiʻona: PCB maʻalahi, PCB kiʻekiʻe kiʻekiʻe
Nā mea hoʻoheheʻe: Epoxy Resin, Metal Composite Materials, Organic Resin
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OEM Intelligent Security PCB mea hana
Nā papa: 1-22 papa
papa mānoanoa: 1.6 mm
Ka mānoanoa keleawe:1 OZ
Mea kumu: FR4
Ka nui o ka puka liʻiliʻi: 0.2mm
Ka laulā laina liʻiliʻi: 4 mil
Ili pau: ke alakai manuahi HASL
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ʻO OEM wikiwiki 5 mau awa hoʻokahi Ethernet Switch Board 10/100M Unmanaged Half-Full Duplex Lay2 PCBA Module
ʻO HT-S1105DS kahi mini compact soho 5 port 10/100mbps 4pin head network switch PCBA. Loaʻa iā 5 10/100mbps 4pin head port i kūkulu ʻia. Plug n play, ʻaʻole pono e hoʻonohonoho. ʻO ka uila komo 3.3V.
Hāʻawi ka mana, loulou / hana alakaʻi i kahi hoʻonā pilikia wikiwiki. -
Nā kukui LED a me nā ipukukui ʻili o ka mauna PCB Terminal Blocks
Helu kumu hoʻohālike: TC280
Māhele: ʻO nā poloka Terminal PCB mauna ʻili
Kaapuni: 2Pin
Ka helu o kēia manawa: 3.0A
Nānā Uila: 200V
ʻĀkau kau kau ʻana o ka papa PC: ʻaoʻao komo -
Hoʻohana ʻia ka papa pcb papa ma ka Mea Lapaʻau me ka hui BGA me ISO 13485
ʻO nā waiwai pale ahi:V1
Nā mea hoʻokaʻawale: Synthetic Resin
Mea: Pepa aniani
Mechanical Rigid: Hiki
ʻenehana hoʻoponopono: Hoʻopaneʻe i ka Foil Pressure, Foil Electrolytic
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Wela Air Leveling Multilayer PCB me Eha Layer
Hoʻohana: kamaʻilio, kamepiula, mea kūʻai uila, mea hana hale, nā mea lapaʻau, papa makuahine, uila uila, hoʻouka uila.
Hiʻona: PCB maʻalahi, PCB kiʻekiʻe kiʻekiʻe
Nā mea hoʻoheheʻe: Epoxy Resin, Metala Composite Materials
Mea: Fiberglass Epoxy Resin & Polyimide Resin
ʻenehana hoʻoponopono: Hoʻopaneʻe i ka Foil Pressure, Foil Electrolytic
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Kiʻekiʻe ʻO OEM Top PCB Laminate me UL Certificate
Hoʻohana: Aerospace, BMS, kamaʻilio, kamepiula, mea kūʻai uila, mea hana hale, LED, nā mea lapaʻau, papa makuahine, uila uila, hoʻopiʻi uila.
Hiʻona: PCB maʻalahi, PCB kiʻekiʻe kiʻekiʻe
Nā mea hoʻoheheʻe: Epoxy Resin, Metal Composite Materials, Organic Resin
Mea: Aluminum Uhi Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Pepa Phenolic Copper Foil Substrate, Synthetic Fiber
ʻenehana hoʻoponopono: Hoʻopaneʻe i ka Foil Pressure, Foil Electrolytic
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Kiʻekiʻe ENIG PCB no ka lāʻau lapaʻau Aerospace pūʻali pale wahi gula mānoanoa 1u”-3u”
Ke hana nei mākou i nā hale hana pcb a me ka hui pcb hoʻokahi. he 400 ka nui o na kanaka. 20% hoʻonui i ka nui o nā kūʻai i kēlā me kēia makahiki. 70% hana mai nā ʻāina ʻē a pau. hana mākou i ka 1-12layer.FR4.CEM-1.CEM-3.HDI. mea AL.
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High quality customization pcb manufacturing board electronic circuit pcb Communication module PCB
Aerospace, kamaʻilio, kamepiula, mea kūʻai uila, mea hana hale, LED, mea lapaʻau, papa makuahine, uila uila, hoʻopaʻa uila
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FR4 Hdi ʻaoʻao ʻelua ʻaoʻao uila papa pcbs
Pono e pale i ke ahi:V0, V1, V2
Nā mea hoʻoheheʻe: Epoxy Resin, Metal Composite Materials, Organic Resin
Mea: Paʻakikī, Fiberglass Epoxy, Pepa Phenolic Copper Foil Substrate, Synthetic Fiber, Ka Pepa Ring Gas Resin
Mechanical Rigid: Hiki
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FPC PCB Rigid Flexible multilayer
Hiʻona: Rigid Flex pcb
Nā Papahana: Multilayer
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Hoʻokumu ʻo Firmware Decode PCB Copy PCB Clone PCB lako polokalamu PCBA Reversing Engineering Service
Noi:
Aerospace, BMS, Hoʻokaʻaʻike, Kamepiula, Mea Hoʻohana Mea Hoʻohana, Mea Paahana Home, LED, Mea Lapaʻau Lapaʻau, Papa makuahine, Uila uila akamai, Hoʻopiʻi uila.
Nā mea hoʻolalelale:
Epoxy Resin, Metala Composite Material, Organic Resin
Material:
Uhi Aluminum Pepa Foil Foil, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Pepa Phenolic Copper Foil Substrate, Synthetic Fiber
ʻenehana hana:
Hoʻopaneʻe Paʻi Foil, Electrolytic Foil
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