One-stop Electronic Manufacturing Services, kōkua iā ʻoe e hoʻokō maʻalahi i kāu huahana uila mai PCB & PCBA

E hoʻonui i ka ʻike! Pehea e hana ai ka chip? I kēia lā ua maopopo iaʻu

Mai kahi hiʻohiʻona ʻoihana, paʻakikī a paʻakikī ke kaʻina hana o kahi chip. Eia naʻe, mai ke kaulahao ʻoihana piha o IC, ua māhele nui ʻia i ʻehā mau ʻāpana: IC design → IC manufacturing → packaging → testing.

uyrf (1)

Kaʻina hana chip:

1. Hoʻolālā Chip

ʻO ka chip he huahana me ka leo liʻiliʻi akā kiʻekiʻe loa ka pololei. No ka hana ʻana i kahi chip, ʻo ka hoʻolālā ka ʻāpana mua. Pono ka hoʻolālā i ke kōkua o ka hoʻolālā chip o ka hoʻolālā chip i koi ʻia no ka hana ʻana me ke kōkua o ka mea hana EDA a me kekahi mau cores IP.

uyrf (2)

Kaʻina hana chip:

1. Hoʻolālā Chip

ʻO ka chip he huahana me ka leo liʻiliʻi akā kiʻekiʻe loa ka pololei. No ka hana ʻana i kahi chip, ʻo ka hoʻolālā ka ʻāpana mua. Pono ka hoʻolālā i ke kōkua o ka hoʻolālā chip o ka hoʻolālā chip i koi ʻia no ka hana ʻana me ke kōkua o ka mea hana EDA a me kekahi mau cores IP.

uyrf (3)

3. Silicon - hāpai

Ma hope o ka hoʻokaʻawale ʻana o ke silikoni, haʻalele ʻia nā mea i koe. Silika maʻemaʻe ma hope o nā ʻanuʻu he nui i hiki i ka maikaʻi o ka hana semiconductor. ʻO kēia ka mea i kapa ʻia he silika uila.

uyrf (4)

4. Silicon - hoolei ingots

Ma hope o ka hoʻomaʻemaʻe ʻana, pono e hoʻolei ʻia ke silika i loko o nā ʻāpana silika. ʻO kahi aniani hoʻokahi o kahi silika uila ma hope o ka hoʻolei ʻia ʻana i loko o ka ingot ma kahi o 100 kg, a ʻo ka maʻemaʻe o ka silikona hiki i 99.9999%.

uyrf (5)

5. Hoʻoponopono waihona

Ma hope o ka hoʻolei ʻia ʻana o ka silicon ingot, pono e ʻoki ʻia ka silicon ingot a pau i ʻāpana, ʻo ia ka wafer a mākou e kapa pinepine ai he wafer, he lahilahi loa. Ma hope iho, hoʻomaʻamaʻa ʻia ka wafer a maikaʻi loa, a maʻalahi ka ʻili e like me ke aniani.

ʻO ke anawaena o nā wafers silikona he 8-inihi (200mm) a me 12-inihi (300mm) ka anawaena. ʻO ka nui o ke anawaena, ʻoi aku ka haʻahaʻa o ke kumukūʻai o hoʻokahi chip, akā ʻoi aku ka kiʻekiʻe o ka paʻakikī o ka hana.

uyrf (6)

5. Hoʻoponopono waihona

Ma hope o ka hoʻolei ʻia ʻana o ka silicon ingot, pono e ʻoki ʻia ka silicon ingot a pau i ʻāpana, ʻo ia ka wafer a mākou e kapa pinepine ai he wafer, he lahilahi loa. Ma hope iho, hoʻomaʻamaʻa ʻia ka wafer a maikaʻi loa, a maʻalahi ka ʻili e like me ke aniani.

ʻO ke anawaena o nā wafers silikona he 8-inihi (200mm) a me 12-inihi (300mm) ka anawaena. ʻO ka nui o ke anawaena, ʻoi aku ka haʻahaʻa o ke kumukūʻai o hoʻokahi chip, akā ʻoi aku ka kiʻekiʻe o ka paʻakikī o ka hana.

uyrf (7)

7. Eclipse a me ka ion injection

ʻO ka mea mua, pono ia e corrode silicon oxide a me silicon nitride i hōʻike ʻia ma waho o ka photoresist, a e hoʻoheheʻe i kahi papa o ke kilika e insulate ma waena o ka pahu aniani, a laila e hoʻohana i ka ʻenehana etching e hōʻike i ka lalo silika. A laila e hoʻokomo i ka boron a i ʻole ka phosphorus i loko o ka hale silika, a laila e hoʻopiha i ke keleawe e hoʻohui me nā transistors ʻē aʻe, a laila e kau i kahi papa o ke kāpili ma luna e hana i kahi papa o ka hale. ʻO ka mea maʻamau, loaʻa i loko o kahi puʻupuʻu ka nui o nā papa, e like me nā ala nui i hui pū ʻia.

uyrf (8)

7. Eclipse a me ka ion injection

ʻO ka mea mua, pono ia e corrode silicon oxide a me silicon nitride i hōʻike ʻia ma waho o ka photoresist, a e hoʻoheheʻe i kahi papa o ke kilika e insulate ma waena o ka pahu aniani, a laila e hoʻohana i ka ʻenehana etching e hōʻike i ka lalo silika. A laila e hoʻokomo i ka boron a i ʻole ka phosphorus i loko o ka hale silika, a laila e hoʻopiha i ke keleawe e hoʻohui me nā transistors ʻē aʻe, a laila e kau i kahi papa o ke kāpili ma luna e hana i kahi papa o ka hale. ʻO ka mea maʻamau, loaʻa i loko o kahi puʻupuʻu ka nui o nā papa, e like me nā ala nui i hui pū ʻia.


Ka manawa hoʻouna: Jul-08-2023