ʻO ke kumu nui o ka mālama ʻana i ka PCB surface e hōʻoia i ka weldability a i ʻole nā mea uila. Ma muli o ka noho ʻana o ke keleawe ma ke ʻano o nā oxides i ka lewa, ʻaʻole hiki ke mālama ʻia e like me ke keleawe kumu no ka manawa lōʻihi, no laila pono e mālama ʻia me ke keleawe.
Nui nā kaʻina hana maʻamau PCB. ʻO nā mea maʻamau he palahalaha, nā mea pale welded welded (OSP), piha -board nickel -plated gula, Shen Jin, Shenxi, Shenyin, nickel chemical, gula, a me ke gula paʻakikī electroplating. hōʻailona.
1. Palahalaha ka ea wela (spray tin)
ʻO ke kaʻina hana maʻamau o ke kaʻina hana pae ʻana o ka ea wela: micro erosion → preheating → coating welding → spray tin → hoʻomaʻemaʻe.
He pālahalaha ka ea wela, ʻike ʻia hoʻi ʻo ka ea wela welded (ʻike pinepine ʻia ʻo ka tin spray), ʻo ia ke kaʻina hana o ka uhi ʻana i ka pahu hoʻoheheʻe (ke alakaʻi) i welded ma ka ʻili PCB a me ka hoʻohana ʻana i ka hoʻomehana e hoʻopaʻa i ka hoʻoponopono ʻana i ka ea. he papa o ka anti-copper oxidation. Hiki iā ia ke hāʻawi i nā papa uhi weldability maikaʻi. ʻO ka weld a pau a me ke keleawe o ka ea wela e hana i ka hui keleawe -tin metala interductive i ka hui ʻana. Ke poho mau nei ka PCB i ka wai i hooheheeia; puhi ka makani i ka wai welded flat wai welded ma mua o ka welded;
Hoʻokaʻawale ʻia ke kiʻekiʻe o ka makani wela i ʻelua mau ʻano: vertical a me ka pae. Manaʻo nui ʻia ʻoi aku ka maikaʻi o ke ʻano ākea. ʻO ia ka mea maʻamau o ka papa hoʻoponopono ʻana i ka ea wela, hiki ke hoʻokō i ka hana automated.
Pōmaikaʻi: lōʻihi ka manawa mālama; ma hope o ka pau ʻana o ka PCB, ua pulu loa ka ʻili o ke keleawe (ua uhi ʻia ka tin ma mua o ke kuʻi ʻana); kūpono no ka wili kepau; ke kaʻina hana makua, ke kumu kūʻai haʻahaʻa, kūpono no ka nānā ʻana a me ka hoʻāʻo uila
Nā hemahema: ʻAʻole kūpono no ka hoʻopaʻa laina; ma muli o ka pilikia o ka palahalaha o ka ʻili, aia kekahi mau palena ma SMT; ʻaʻole kūpono no ka hoʻolālā hoʻololi pili. I ka wā e pīpī ai i ka tin, e hoʻoheheʻe ʻia ke keleawe, a he wela kiʻekiʻe ka papa. ʻOi aku ka mānoanoa a i ʻole nā papa lahilahi, ua kaupalena ʻia ke kīpī, a ʻaʻole kūpono ka hana hana.
2, mea pale weldability organik (OSP)
ʻO ke kaʻina hana maʻamau: degreasing -> micro-etching -> pickling -> hoʻomaʻemaʻe wai maʻemaʻe -> hoʻomaʻemaʻe organik -> hoʻomaʻemaʻe, a maʻalahi ke kaʻina hana e hōʻike i ke kaʻina hana.
He kaʻina hana ʻo OSP no ka mālama ʻana i ka ʻili keleawe keleawe (PCB) e like me nā koi o ke kuhikuhi RoHS. He pōkole ʻo OSP no Organic Solderability Preservatives, i ʻike ʻia hoʻi he organic solderability preservatives, i kapa ʻia ʻo Preflux ma ka ʻōlelo Pelekania. ʻO ka ʻōlelo maʻalahi, ʻo OSP kahi kiʻiʻoniʻoni ʻili kūlohelohe i hoʻoulu ʻia ma ka ʻili keleawe maʻemaʻe. ʻO kēia kiʻiʻoniʻoni he anti-oxidation, haʻalulu wela, pale ʻana i ka moisture, e pale i ka ʻili keleawe i loko o ke kaiapuni maʻamau ʻaʻole i ʻōpala (oxidation a vulcanization, etc.); Eia nō naʻe, i ka hoʻoheheʻe ʻana i ka wela kiʻekiʻe, pono e wehe koke ʻia kēia kiʻi pale e ka flux, i hiki ke hui koke ʻia ka ʻili keleawe maʻemaʻe me ka mea hoʻoheheʻe ʻia i loko o kahi manawa pōkole loa e lilo i hui solder paʻa.
Pōmaikaʻi: He maʻalahi ke kaʻina hana, palahalaha loa ka ʻili, kūpono no ka hoʻoheheʻe alakaʻi a me ka SMT. Maʻalahi e hana hou, hana maʻalahi, kūpono no ka hana laina laina. He kūpono ka papa no ka hana ʻana he nui (e laʻa me OSP+ENIG). ʻO ke kumukūʻai haʻahaʻa, pili kaiapuni.
Nā hemahema: ʻo ka palena o ka helu o ka reflow welding (nui ka welding mānoanoa, e luku ʻia ke kiʻiʻoniʻoni, ʻo 2 mau manawa ʻaʻohe pilikia). ʻAʻole kūpono no ka ʻenehana crimp, hoʻopaʻa uea. ʻAʻole kūpono ka ʻike maka a me ka ʻike uila. Pono ka pale kinoea N2 no SMT. ʻAʻole kūpono ka hana hou ʻana o SMT. Nā koi mālama kiʻekiʻe.
3, ʻo ka pā holoʻokoʻa i uhi ʻia i ke gula nickel
ʻO ka Plate nickel plating ka PCB surface conductor i hoʻopaʻa mua ʻia me kahi papa nickel a laila uhi ʻia me kahi papa gula, ʻo ka nickel plating ka mea nui e pale i ka diffusion ma waena o ke gula a me ke keleawe. Elua ano o ka electroplated nickel gula: palupalu gula plating (maʻemaʻe gula, ili gula 'aʻole nānā 'ālohilohi) a paʻa gula plating (paheʻe a me ka paʻakikī ili, aahu-kū pale, loaʻa nā mea 'ē aʻe e like me ka cobalt, ili gula nana alohilohi). Hoʻohana nui ʻia ke gula palupalu no ka uwea gula puʻupuʻu chip; Hoʻohana nui ʻia ke gula paʻa i nā interconnections uila non-welded.
Pōmaikaʻi: Ka lōʻihi o ka mālama ʻana > 12 mahina. He kūpono no ka hoʻolālā hoʻololi hoʻopili a me ka hoʻopaʻa uea gula. He kūpono no ka ho'āʻo uila
Nawaliwali: ʻOi aku ke kumu kūʻai, ʻoi aku ke gula mānoanoa. Pono nā manamana lima i hoʻopaʻa ʻia. No ka mea, ʻaʻole kūlike ka mānoanoa o ke gula, ke hoʻohana ʻia i ka kuʻi ʻana, hiki ke kumu i ka embrittlement o ka hui solder ma muli o ke gula mānoanoa loa, e pili ana i ka ikaika. Electroplating ili like pilikia pilikia. ʻAʻole uhi ke gula nickel electroplated i ka lihi o ka uea. ʻAʻole kūpono no ka hoʻopaʻa uea alumini.
4. Holoi gula
ʻO ke kaʻina hana maʻamau: ʻo ka hoʻomaʻemaʻe pickling -> micro-corrosion -> preleaching -> hoʻoulu ʻia -> electroless nickel plating -> kemika gula leaching; He 6 mau pahu kemika i loko o ke kaʻina hana, e pili ana ma kahi o 100 mau ʻano kemika, a ʻoi aku ka paʻakikī o ke kaʻina hana.
Hoʻopili ʻia ke gula i loko o kahi ʻāpana gula nickel mānoanoa, uila maikaʻi ma ka ʻili keleawe, hiki ke pale i ka PCB no ka manawa lōʻihi; Eia kekahi, loaʻa iā ia ke ahonui kaiapuni i loaʻa ʻole i nā kaʻina hana lapaʻau ʻē aʻe. Eia kekahi, hiki i ke gula ke pale i ka hemo ʻana o ke keleawe, kahi e pōmaikaʻi ai ka hui alakaʻi ʻole.
Pōmaikaʻi: ʻaʻole maʻalahi ka oxidize, hiki ke mālama ʻia no ka manawa lōʻihi, palahalaha ka ʻili, kūpono no ka hoʻopili ʻana i nā pin a me nā ʻāpana me nā hui solder liʻiliʻi. ʻO ka papa PCB makemake me nā pihi (e like me ka papa kelepona paʻalima). Hiki ke hana hou ʻia ka welding reflow i nā manawa he nui me ka ʻole o ka nalowale o ka weldability. Hiki ke hoʻohana ʻia ma ke ʻano he kumu kumu no ka uea COB (Chip On Board).
Nā hemahema: ke kumu kūʻai kiʻekiʻe, ka ikaika welding maikaʻi ʻole, no ka hoʻohana ʻana i ke kaʻina nickel non-electroplated, maʻalahi ka loaʻa ʻana o nā pilikia diski ʻeleʻele. Hoʻopili ka papa nickel i ka manawa, a he pilikia ka hilinaʻi lōʻihi.
5. Pihoihoi
No ka mea, hoʻokumu ʻia nā mea kūʻai aku a pau i kēia manawa, hiki ke hoʻohālikelike ʻia ka papa tin i kēlā me kēia ʻano solder. Hiki i ke kaʻina hana o ke kini pila ke hoʻokumu i nā pūhui intermetallic copper-tin metala, kahi e loaʻa ai ka solderability maikaʻi o ka puʻu e like me ka pae ʻana o ka ea wela me ka pilikia ʻole o ke poʻo o ke ea wela; ʻAʻole hiki ke mālama ʻia ka pā kini no ka lōʻihi loa, a pono e hoʻokō ʻia ka hui e like me ke ʻano o ka poho ʻana.
Pōmaikaʻi: He kūpono no ka hana laina laina. He kūpono no ka hoʻoponopono laina maikaʻi, kūpono no ka hoʻoheheʻe kepau ʻole, kūpono loa no ka ʻenehana crimping. ʻO ka palahalaha maikaʻi loa, kūpono no SMT.
Pono ʻole: Pono nā kūlana mālama maikaʻi, ʻoi aku ka maikaʻi ma mua o 6 mau mahina, no ka hoʻomalu ʻana i ka ulu ʻana o ka whisker tin. ʻAʻole kūpono no ka hoʻolālā hoʻololi pili. Ma ke kaʻina hana, ʻoi aku ka kiʻekiʻe o ke kaʻina hana kiʻi ʻoniʻoni kūwaho, inā ʻaʻole ia e hāʻule ke kiʻi kūʻē kūʻē. No ka wiliwili lehulehu, ʻoi aku ka maikaʻi o ka pale kinoea N2. ʻO ke ana uila kekahi pilikia.
6. Ke kala poho
ʻO ke kaʻina hoʻoheheʻe kālā ma waena o ka uhi kūlohelohe a me ka electroless nickel/gold plating, maʻalahi ke kaʻina hana a wikiwiki hoʻi; ʻOiai ke ʻike ʻia i ka wela, ka haʻahaʻa a me ka haumia, hiki i ke kālā ke mālama i ka weldability maikaʻi, akā e nalowale kona luster. ʻAʻole i loaʻa ka ikaika kino maikaʻi o ka hoʻopaʻa ʻana i ke kala kala ʻole o ka nickel plating electroless/plating gula no ka mea ʻaʻohe nickel ma lalo o ka papa kālā.
Pōmaikaʻi: ʻO ke kaʻina hana maʻalahi, kūpono no ka hoʻoheheʻe alakaʻi ʻole, SMT. ʻO ka ʻili palahalaha loa, ke kumu kūʻai haʻahaʻa, kūpono no nā laina maikaʻi loa.
Nā hemahema: ʻO nā koi mālama kiʻekiʻe, maʻalahi e hoʻohaumia. Pilikia ka ikaika welding i nā pilikia (micro-cavity problem). He mea maʻalahi ka loaʻa ʻana o ka hanana electromigration a me ka mea nahu Javani o ke keleawe ma lalo o ke kiʻi ʻoniʻoni kūwaho. ʻO ke ana uila kekahi pilikia
7, kemika nickel palladium
Ke hoʻohālikelike ʻia me ka ua o ke gula, aia kahi papa o ka palladium ma waena o ka nickel a me ke gula, a hiki i ka palladium ke pale i ka hanana corrosion i hoʻokumu ʻia e ka hopena o ka hoʻololi ʻana a hoʻomākaukau piha no ka ua o ke gula. Ua uhi paʻa ʻia ke gula me ka palladium, e hāʻawi ana i kahi ʻili pili maikaʻi.
Pōmaikaʻi: He kūpono no ka hoʻoheheʻe kepau-ʻole. He ʻili palahalaha loa, kūpono no SMT. Ma nā puka e hiki ai ke nickel gula. ʻO ka manawa mālama lōʻihi, ʻaʻole paʻakikī nā kūlana mālama. He kūpono no ka ho'āʻo uila. He kūpono no ka hoʻolālā hoʻololi pili. He kūpono no ka hoʻopaʻa ʻana i ka uea alumini, kūpono no ka pā mānoanoa, kūpaʻa ikaika i ka hoʻouka kaua ʻana.
8. Electroplating gula paakiki
I mea e hoʻomaikaʻi ai i ka pale ʻana o ka huahana, hoʻonui i ka helu o ka hoʻokomo ʻana a me ka wehe ʻana a me ka electroplating gula paʻakikī.
ʻAʻole nui loa ka PCB ma luna o ke kaʻina hana, me he mea lā he mea mamao loa ia, akā pono e hoʻomaopopo ʻia ʻo nā loli lohi lōʻihi e alakaʻi i nā loli nui. I ka hihia o ka hoʻonui ʻana i nā kelepona no ka mālama ʻana i ke kaiapuni, e loli maoli ke kaʻina hana o ka PCB i ka wā e hiki mai ana.
Ka manawa hoʻouna: Jul-05-2023
