E aʻo i kēia, ʻaʻole papa ka papa PCB!

I ka wā o ka hana ʻana o nā papa PCB, nui nā kūlana i manaʻo ʻole ʻia, e like me ke keleawe electroplated, ke keleawe keleawe kemika, ka plating gula, tin-lead alloy plating a me nā mea ʻē aʻe plating layer delamination. No laila he aha ke kumu o kēia stratification?

Ma lalo o ka irradiation o ke kukui ultraviolet, hoʻoheheʻe ʻia ka photoinitiator e hoʻomoʻa i ka ikehu māmā i loko o ka pūʻulu manuahi e hoʻoulu ai i ka hopena photopolymerization a hoʻokumu i ka mole kino i hiki ʻole ke hoʻoheheʻe ʻia i ka solution alkali dilute. Ma lalo o ka hoʻolaha ʻana, ma muli o ka polymerization incomplete, i ka wā o ka hoʻomohala ʻana, ka pehu a me ka palupalu o ke kiʻiʻoniʻoni, ka hopena i nā laina ʻike ʻole a hiki i ke kiʻiʻoniʻoni ke hāʻule, e hopena i ka paʻa maikaʻi ʻole ma waena o ke kiʻiʻoniʻoni a me ke keleawe; Inā ʻoi aku ka nui o ka hoʻolaha ʻana, e hoʻopilikia ia i ka hoʻomohala ʻana, a e hoʻopuka pū kekahi i ka warping a me ka peeling i ka wā o ka plating, e hana ana i ka infiltration plating. No laila he mea nui e hoʻomalu i ka ikehu hoʻolaha; Ma hope o ka mālama ʻia ʻana o ka ʻili o ke keleawe, ʻaʻole maʻalahi ka lōʻihi o ka manawa hoʻomaʻemaʻe, no ka mea, ʻo ka wai hoʻomaʻemaʻe pū kekahi i loko o kekahi mau mea acidic, ʻoiai he nāwaliwali kona ʻike, akā ʻaʻole hiki i ka hopena ma ka ʻili o ke keleawe. e lawe māmā ʻia, a pono e hoʻokō ʻia ka hana hoʻomaʻemaʻe e like me nā kikoʻī o ke kaʻina hana.

ʻO ke kumu nui o ka hāʻule ʻana o ka papa gula mai ka ʻili o ka papa nickel ʻo ia ka mālama ʻana o ka nickel. He paʻakikī ka loaʻa ʻana o nā hopena ʻoluʻolu i ka hana ʻino ma luna o ka metala nickel. ʻO ka ili o ka nickel coating he maʻalahi ke hana i ka passivation film i ka lewa, e like me ka mālama pono ʻole, e hoʻokaʻawale ia i ka ʻāpana gula mai ka ʻili o ka papa nickel. Inā ʻaʻole kūpono ka hoʻoulu ʻana i ka electroplating, e hoʻoneʻe ʻia ka papa gula mai ka ʻili o ka papa nickel a peel. ʻO ke kumu ʻelua, ʻo ia ma hope o ka hoʻāla ʻana, lōʻihi ka manawa hoʻomaʻemaʻe, e hana hou ʻia ka kiʻiʻoniʻoni passivation ma luna o ka nickel surface, a laila e gilded, e hoʻopuka i nā hemahema i ka uhi.

Nui nā kumu no ka plating delamination, inā makemake ʻoe e hana i kahi kūlana like i ke kaʻina hana o ka papa hana ʻaʻole i hiki mai, he pilina koʻikoʻi me ka mālama a me ke kuleana o nā technicians. No laila, e alakaʻi kahi mea hana PCB maikaʻi loa i ka hoʻomaʻamaʻa kūlana kiʻekiʻe no kēlā me kēia limahana hana i mea e pale ai i ka lawe ʻana i nā huahana haʻahaʻa.