Mai ka papa paʻakikī multi-layer a hiki i ʻelua ʻaoʻao ʻaoʻao mauna hoʻolālā, ʻo kā mākou pahuhopu e hāʻawi iā ʻoe i kahi huahana maikaʻi e kūpono i kāu mau koi a ʻo ia ke kumu kūʻai maikaʻi loa i ka hana ʻana.
ʻO kā mākou ʻike i nā kūlana IPC papa III, nā koi hoʻomaʻemaʻe koʻikoʻi, ke keleawe kaumaha a me nā hoʻomanawanui hana e hāʻawi iā mākou i kā mākou mea kūʻai aku i ka mea e pono ai no kā lākou huahana hope.
Nā huahana ʻenehana kiʻekiʻe:
Backplanes, nā papa HDI, nā papa alapine kiʻekiʻe, nā papa TG kiʻekiʻe, nā papa halogen-free, nā papa maʻalahi a paʻakikī, nā hybrids a me nā papa me nā noi i nā huahana kiʻekiʻe.
20-papa PCB, 2 mil ka laulā laina:
ʻO kā mākou ʻike hana hana 10 mau makahiki, nā mea hana kiʻekiʻe a me nā mea hoʻāʻo e hiki ai iā VIT ke hana i nā papa paʻa 20-layer a me nā kaʻa a hiki i ka 12 papa.
ʻO ka mānoanoa o ka mokulele a hiki i .276 (7mm), nā hiʻohiʻona hiʻona a hiki i 20:1, 2/2 laina/wāwae a me nā hoʻolālā hoʻomalu impedance e hana ʻia i kēlā me kēia lā.
Nā huahana a me ka hoʻohana ʻenehana:
E noi i nā kamaʻilio, aerospace, pale, IT, nā mea lapaʻau, nā mea hoʻāʻo pololei a me nā ʻoihana ʻoihana
Nā paena maʻamau no ka hana ʻana i nā PCB:e hoʻokumu ʻia ka nānā ʻana a me ka hoʻāʻo ʻana ma luna o IPC-A-600 a me IPC-6012, papa 2 ke ʻole i kuhikuhi ʻia ma nā kiʻi a i ʻole nā kikoʻī kikoʻī.
ʻO ka lawelawe hoʻolālā PCB:Hiki iā VIT ke hāʻawi i ka lawelawe hoʻolālā PCB i kā mākou mea kūʻai
I kekahi manawa, hāʻawi wale kā mākou mea kūʻai iā mākou i ka faila 2D a i ʻole he manaʻo wale nō, a laila mākou e hoʻolālā i ka PCB, hoʻonohonoho a hana i ka faila Gerber no lākou.
'ikamu | wehewehe | Nā mana ʻenehana |
1 | Nā ʻāpana | 1-20 papa |
2 | Nui ka nui o ka papa | 1200x600mm (47x23") |
3 | Nā mea waiwai | FR-4, TG FR4 kiʻekiʻe, mea manuahi halogen, Rogers, Arlon, PTFE, Taconic, ISOLA, seramika, aluminika, kumu keleawe |
4 | Mānoanoa papa nui | 330mil (8.4mm) |
5 | Min laula laina i loko | 3mil (0.075mm)/3mil (0.075mm) |
6 | Min laula laina waho | 3mil (0.75mm)/3mil (0.075mm) |
7 | Min hoʻopau lua nui | 4mil (0.10mm) |
8 | Min ma ka nui o ka lua a me ka pā | Via: anawaena 0.2mm Pad: 0.4mm ke anawaena HDI <0.10mm ma o |
9 | Min hole tolerance | ±0.05mm (NPTH), ±0.076mm (PTH) |
10 | Hoʻopau ʻia ka nui o ka lua (PTH) | ±2mil (0.05mm) |
11 | Hoʻopau ʻia ka nui o ka lua (NPTH) | ±1mil (0.025mm) |
12 | ʻO ka hoʻomanawanui hoʻokaʻawale kūlana puka | ±2mil (0.05mm) |
13 | Min S/M pitch | 3mil (0.075mm) |
14 | Solder mask paʻakikī | ≥6H |
15 | Ka hikiwawe | 94V-0 |
16 | Hoʻopau ʻili | OSP, ENIG, gula ʻālohilohi, tini kaiapuni, HASL, i uhi ʻia i ke tini, kala kaiapuni,ka inika kalapona, pale-off mask, manamana gula (30μ"), kala kaiapuni (3-10u"), ipu kaiapuni (0.6-1.2um) |
17 | ʻoki ʻoki V | 30/45/60°, hoʻomanawanui ±5° |
18 | Min V-oki mānoanoa papa | 0.75mm |
19 | Min makapō / kanu ʻia ma o | 0.15mm (6mil) |