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Jetson AGX Orin NVIDIA Developer Kit Development Kit Server-level ai

ʻO ka wehewehe pōkole:

He kūpono no nā ʻāpana noi like ʻole

Hiki i ka mea hoʻomohala ke kūkulu i nā robotics kiʻekiʻe a me nā noi AI no nā ʻoihana e like me ka hana ʻana, logistic, hale kūʻai, ke kūʻai aku ʻana i ka lawelawe, mālama olakino a me nā ʻepekema ola.


Huahana Huahana

Huahana Huahana

Hōʻike huahana

ʻO Jetson AGX Orin mea hoʻomohala suite

Me nā lolouila AI ikaika, e lawe mai i kahi hanauna hou o nā mīkini ʻokoʻa ikaika. Me ka 275 TOPS o ka mana helu helu, ʻo Jetson Orin he 8 mau manawa o ka hana o ka hanauna mua o nā paipu inference AI i hui pū ʻia, a kākoʻo i nā kikowaena kiʻekiʻe kiʻekiʻe o ka sensor, e hāʻawi ana i ka hopena kūpono no nā robots hou.

E hoʻomaka i ka hoʻomohala ʻana me ka NVIDIAR Jetson AGX Orin "¢ developer suite. Aia kēia pahu i nā modula JetsonAGX Orin hana kiʻekiʻe, ʻoi aku ka ikaika o ka ikehu e hiki ke hoʻohālike i nā modules Jetson Orin ʻē aʻe. nā robotics holomua a me nā noi AI no nā ʻoihana e like me ka hana ʻana, logistic, retail, services, griculture, smart city, healthcare and life science.

Kūlana kikoʻī

ʻO ka pahu hoʻomohala ʻo Jetson AGX Orin

Helu kumu hoʻohālike

32GB pahu hoʻomohala

64GB pahu hoʻomohala

AI hana 275 NUI
GPU Loaʻa iā 2048 NVIDIA⑧CUDA⑧ cores a me 64
ʻO ka hoʻolālā NVIDIA Ampere no Tensor Core
CPU 12 kumu Arm Cortex-A78AE v8.264 hoʻonohonoho CPU
3MB L2+6MB L3
DL mea hoʻokē 2x NVDLA v2.0
Mea hoʻokē ʻike PVA v2.0
Hoʻomanaʻo wikiō 32GB 256setLPDDR5
204.8GB/s
64GB 256setLPDDR5
204.8GB/s
Halekuai 64GB eMMC 5.1
Hoʻopili wikiō 2x4K60|4x 4K30|8x1080p60|16x 1080p30
(H.265)

 

Wehewehe wikiō 1x 8K30|3x4K60|7x4K30|11x1080p60 |
22x 1080p30(H.265)
No ka papa inoa o nā mea i kākoʻo ʻia, e ʻike i ka ʻāpana "Software Features" o ka NVIDIA Jetson Linux Developer Guide hou.
Kāmeʻa 16-kanal MIPI hoʻohui CSI-2
PCIe x16 PCIe slot: Haʻahaʻa haʻahaʻa x8 PCIe 4.0
RJ45 A hiki i 10 GbE
M.2 Ki M x4 PCIe 4.0
M.2 Ki E x1 PCIe 4.0,USB 2.0,UART,I2S
USB Type-C 2x USB 3.22.0, kākoʻo USB-PD
ʻAno USB-A 2x USB 3.22.0 2x USB 3.21.0
USB Micro-B USB 2.0
HōʻikePort Hōʻike Port 1.4a(+MST)
puana microSD Kākoʻo ke kāleka UHS-1 i ke ʻano SDR104 kiʻekiʻe loa
'ē aʻe 40 mau mea hoʻopili (I2C, GPIO, SPI, CAN, I2S, UART, DMIC)
12 pin mea hoʻohui ʻakomi
10-pin mea hoʻohui leo panel
Hoʻohui JTAG 10-pin
4-pin mea hoʻohui peʻahi
2-pin RTC mea hoʻokuʻu pila
Puku mana Dc
Mana, hoʻihoʻi ikaika, a hoʻihoʻi hou i nā pihi
Anana 110 mm x110 mm x 71.65 mm
(Ke kiʻekiʻe ka bracket, ka mea lawe, ka module a me ka hoʻonā hoʻoluʻu)

 

ʻO Jetson AGX Orin module

Helu kumu hoʻohālike

ʻO Jetson AGX Orin 32GBmodule

ʻO Jetson AGX Orin 64GBmodule

AI hana

200 NUI

275 NUI

GPU

Me 56 Tensor cores
1792 nukelea NVIDIA A mper rack
GPU930 MHz

Me 64 Tensor cores
2048 kumu NVIDIA Ampere
Hoʻolālā GPU

GPU kiʻekiʻe alapinepine

930 MHz

1.3 GHz

CPU

8coreArm⑧CortexR-A78AE
v8.264setCPU
2MB L2 +4MB L3

12coreArm⑧CortexR-
A78AE v8.264setCPU
3MB L2 +6MB L3

ʻO ke alapine CPU kiʻekiʻe

2.2 GHz

DL mea hoʻokē

2x NVDLA v2

DLA kiʻekiʻe alapinepine

1.4 GHz

1.6 GHz

Mea hoʻokē ʻike

1x PVA v2

Hoʻomanaʻo wikiō

32GB 256setLPDDR5
204.8GB/s

64 GB 256setLPDDR5
204.8GB/s

Halekuai

64GB eMMC 5.1

Hoʻopili wikiō

1x4K60 (H.265
3x4K30(H.265
6x 1080p60 (H.265)
12x1080p30 (H.265)

2x4K60(H.265
4x4K30(H.265
8x 1080p60 (H.265)
16x 1080p30 (H.265)

Wehewehe wikiō

1x8K30 (H.265)
2x4K60(H.265)
4x 4K30 (H.265)
9x 1080p60 (H.265)
18x 1080p30(H.265)

1x 8K30 (H.265)
3x4K60(H.265
7x4K30(H.265)
11x1080p60(H.265)
22x1080p30(H.265

Kāmeʻa

A hiki i 6 mau kāmeʻa (a hiki i 16 i kākoʻo ʻia ma ke kahawai virtual)
16 kaha MIPICSI-2
D-PHY 2.1(a hiki i 40Gbps)|C-PHY 2.0(a hiki i 164Gbps)

PCIe*

A hiki i 2x8+1x4+2x1(PCIe4.0, awa kumu a me ka hopena)

USB*

3x USB 3.22.0 (10 Gbps) a me 4x USB 2.0

Pūnaewele*

1x GbE, 1x 10GbE

Hōʻike ʻike

1x8K60 ʻano ʻano lehulehu DP 1.4a(+MST)/eDP 1.4a/HDMI2.1

I/O ʻē aʻe

4x UART, 3x SPI, 4xI2S, 8xI2C, 2xCAN, PWM, DMIC a meDSPK,
GPIO

Ka mana

1 5 W - 4 0 W

1 5 W - 6 0 W

Hōʻike a me ka nui

100 mm x87 mm, 699 pin mea hoʻohui Molex Mirror Mezz
Pākuʻi thermal conductive pā

 


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