Kiʻekiʻe ENIG PCB no ka lāʻau lapaʻau Aerospace pūʻali pale wahi gula mānoanoa 1u”-3u”

Ke hana nei mākou i pcb a me pcb hui hoʻokahi hale hana lawelawe. he 400 ka nui o na kanaka. 20% hoʻonui i ke kūʻai aku i kēlā me kēia makahiki. 70% hana mai nā ʻāina ʻē a pau. hana mākou i ka 1-12layer.FR4.CEM-1.CEM-3.HDI. mea AL. ʻoluʻolu mākou i nā kauoha prototypes. ʻO nā hiʻohiʻona pcb maʻamau e pili ana i nā lā 3 hiki iā mākou ke hoʻouna i kāu i loko o 12hour a i ʻole 24hour uku i nā koina wikiwiki. pcba prototypes e pili ana i 1day hiki ke lawe. smt a luu a ma ka lima na mea hiki ke hana. hookomo i na mea 0201.BGA. 100% ʻōlelo hoʻohiki maikaʻi. no ka ʻimi lele. Papa ho'āʻo E.X-RAY.AOI. Ka ho'āʻo hana no kēlā me kēia papa. hiki iā mākou ke hana i ka hoʻolālā hoʻolālā a kope paha i ka papa inā ʻaʻohe faila pcb gerber a me ka papa inoa bom. hiki iā ʻoe ke hoʻouna i kāu previours true sample iā mākou inā loaʻa. e ʻoluʻolu e hāʻawi mai i ke kiʻi shematic. nui outline. ʻāpana datasheet inā ʻaʻohe laʻana maoli. ʻoiaʻiʻo mākou e hoʻoponopono a hana hou a lawe paha i nā kumukūʻai pilikia maikaʻi inā hana maikaʻi ko mākou ʻaoʻao. e pane ʻia kekahi pane i loko o 5 hola. loaʻa iā mākou ISO9001.TS16949.SGS.UL. palapala hōʻoia ROHS. Ke nānā nei i mua e lohe mai kāu koke. hoʻokipa koke i kāu hāʻawi.

Nā palena ʻenehana
•Material:FR-4,CEM-3,CEM-1,AL ,HDI, Halogen-noa , Nā papa seramika
• Min Solder Mask alahaka:0.1mm
• Min / max Solder Mask mānoanoa: 10um-25um
•Min paʻa solder anawaena:0.1mm(hoʻokahi aoao)
•Ka hoʻomanawanui anawaena:PTH ±0.076mm NPTH ±0.05mm
•Tenting by Mask (yes/no): ʻAe
• Ka helu o ka Layer: 1-12 LAYERS
• Mānoanoa Papa:0.4mm—3.5mm
•Ka hoʻomanawanui mānoanoa (t≥0.8mm):0.8 +/-0.1mm;1.2-1.6 +/-0.13mm;2.4 +/-0.18mm;3.2 +/-0.25mm
•Ka hoʻomanawanui mānoanoa (T<0.8mm):0.4-0.6 +/-0.1mm
•Ka laina liʻiliʻi (0,5OZ):0.10mm(no ka hoʻopaʻa ʻana i ke gula): Space liʻiliʻi (0,5OZ)0.10mm (no ka hoʻopaʻa ʻana i ke gula)
•Laina liʻiliʻi loa (1OZ):0.15mm:Laina liʻiliʻi loa (2OZ):0.20mm
•Laina liʻiliʻi loa (3OZ):0.25mm:Luna liʻiliʻi (1OZ):0.15mm
•Luna liʻiliʻi (2OZ):0.20mm
•Luna liʻiliʻi (3OZ):0.25mm
• Out Layer Copper Manoanoa:0.5-2OZ
• Ka mānoanoa keleawe o loko: 0.5-2OZ
•Puka wili Min(Hoʻopau):0.25mm
• ke apo Annular:0.1mm Kakau inoa:±0.1mm
•Aspect Ratio:Ma o Puka - 8:1
•Solder Mask kala:'ōmaʻomaʻo, ʻeleʻele, ʻulaʻula, keʻokeʻo. Mini. Hoʻomaʻemaʻe mask solder:0.05mm
•Legend kala:'ōmaʻomaʻo, keʻokeʻo, ʻulaʻula, melemele, ʻeleʻele.
• Nui Papa Nui:500x600mm
•Twist a me ke Kakaka (no ka hui SMT):≤0.75%
Mānoanoa Tin/Lead HASL:5-25um