ʻO ka papa kiʻekiʻe, hoʻohana ʻia no nā mea lapaʻau i hōʻike ʻia

ʻO ka papa kuhikuhi kiʻekiʻe, hoʻohana ʻia no nā mea hana lapaʻau

ʻO ka wehewehe pōkole:

Noi:
Aerospace, BMS, Hoʻokaʻaʻike, Kamepiula, Mea Hoʻohana Mea Hoʻohana, Mea Hana Home, LED, Mea Hana Lapaʻau, Papa makuahine, ʻelepona akamai, Hoʻopiʻi uila.

Hiʻona:PCB Fexible, PCB mānoanoa kiʻekiʻe.

Nā mea hoʻolalelale:Epoxy Resin, Metala Composite Material, Organic Resin.

Material:ʻO ka Aluminum Uhi Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Pepa Phenolic Copper Foil Substrate, Synthetic Fiber.

ʻenehana hana: Hoʻopaneʻe Paʻi Foil, Electrolytic Foil.

Helu kumu hoʻohālike:XinDaChang-BC-008

Kapa inoa:XinDaChang PCB hui

E hoʻouna i ka leka uila iā mākou

Huahana Huahana

Hōʻike huahana:

'ikamu NO	2 Kauoha 8 papa Immersion Gold OSP HDI PCBhui ana
Mea waiwai	FR-4
Nā ʻāpana	8 Papahana
Mānoanoa Hoʻopau	0.70mm
Hoʻopau ʻili	Gula Kaiapuni+OSP
Ka Laulā ʻImi/ Wahi Huli	Iloko: 0.05mm/0.05mm Iwaho: 0.05mm/0.05mm
Ka nui o ka lua min (um)	Ka wili Mechanical: 0.2mm ʻO ka wili laser: 0.1mm

Ka Mana Mana

ʻO ka papa kuhikuhi kiʻekiʻe, hoʻohana ʻia no nā mea lapaʻau2

a. 100％AOI,100％E-Ho'āʻo,100％FQC + FQA
b. Nā polokalamu SPC a me CPK
c. Nā polokalamu Lean Manufacturing a me 7S
d. ʻO ka nānā kiʻekiʻe a me nā mea hana hoʻokolohua
e. Hōʻike QA maʻamau me kēlā me kēia hoʻouna
f. Hoʻokō RoHS

Pōmaikaʻi ʻoihana

ʻO ka papa kuhikuhi kiʻekiʻe, hoʻohana ʻia no nā mea hana lapaʻau

a. Hoʻokahi kū, nā ʻano like ʻole, hana nui, pane wikiwiki, hoʻokō i nā pono āpau o nā mea kūʻai aku
Hāʻawi
a. ʻO nā faila Gerber
b. Nā ʻāpana PCB a me ka pepa koi
c. Ka Nui Koi

Hāʻawi

ʻO ka papa kuhikuhi kiʻekiʻe, hoʻohana ʻia no nā mea hana lapaʻau1

a. No ka laʻana, ka manawa hoʻouna ma kahi o 15 lā hana.
b. No nā liʻiliʻi liʻiliʻi, ka manawa hoʻouna ma kahi o 30 lā hana.
c. No ka hana nui, ka manawa lawe ma kahi o 49 lā hana.
ʻO nā lā hoʻopuka kūikawā e pili ana i nā kūlana maoli, akā e hana mākou i ka mea maikaʻi loa e kākoʻo a hoʻokō i kāu mau pono.